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High frequency material RO4350B has excellent high frequency performance due to low |
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dielectric tolerance and loss, stable electrical properties vs frequency, low thermal coefficient of |
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dielectric constant. It's widely used in power divider, coupler, power amplifier, trunk amplifier, 3G |
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and 4G antenna. |
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PCB and Services |
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a) Double-layer, Multi-layer PCB |
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b) FR-4 and RO4350B combined PCB |
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c) Different RO4350B laminates: 10mil (0.254mm), 13.3mil (0.338mm), 20mil (0.508mm) |
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30mil (0.762mm), 60mil(1.524mm) |
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d) Base copper 0.5oz and 1oz |
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e) Solder mask most commonly used: Green and Red |
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f) Surface finish most commonly used:Immersion gold, copper exposure, HASL |
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g) Prototype, small batches run and volume production. |
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h) MOQ: 1PCS. Door to door shipment service |
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10 layer PCB, RO4350B multilayer PCB |
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TOP Layer: signal - 1/2oz foil + 25μm Cu |
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Core RO4350B -0.254mm |
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INT 1: mixed - 1/2oz foil |
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Prepreg RO4450B -0.202mm (2 x 0.101) |
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INT 2: mixed - 1/2oz foil |
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Core RO4350B -0.254mm |
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INT 3: mixed - 1/2oz foil |
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Prepreg RO4450B -0.202mm (2 x 0.101) |
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INT 4: mixed - 1/2oz foil |
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Core RO4350B -0.254mm |
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INT 5: mixed - 1/2oz foil |
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Prepreg RO4450B -0.202mm (2 x 0.101) |
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INT 6: mixed - 1/2oz foil |
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Core RO4350B -0.254mm |
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INT 7: mixed - 1/2oz foil |
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Prepreg RO4450B -0.202mm (2 x 0.101) |
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INT 8: mixed - 1/2oz foil |
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Core RO4350B -0.254mm |
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BOT Layer: signal - 1/2oz foil + 25μm Cu |
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